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Since the beginning of the year, ECM ENGINEERING – ECM Repair Specialists; have been researching the problems with the CPC-4 modules used in Freightliner and Western Star trucks.
We have found that the original lead-free solder used to install the BGA( Ball grid array ) chip can break after repeated temperature changes and constant vibration.
Our process starts by removing the protective coating on your CPC board. Attempting to remove the chip without removing the protective coating could damage the components. Once the conformal coating is removed, we remove the chip and clean, lead-free solder.
The BGA is removed and replaced on one of our fully automated rework stations. These stations control heat dissipation by regulating both time and temperature, allowing us to target critical areas of the board without damaging surrounding components. While numerous do-it-yourself videos recommend hair dryers and heat guns, we caution you to avoid attempting these quick fixes.
At best, they provide a short-term fix without addressing the root cause; at worst, they irreparably damage your CPC. Our tools and techniques allow for precise inspection and reliable results. In addition to rigorous bench testing, we subject PCs to thorough visual inspection, and our X-ray equipment will enable us to inspect the solder joints.
Among them is the BGA, and we check it for other defects. All this work is performed at our certified facility in Orlando, Florida.
After assembly, our shipping team quickly packs your module in a well-protected manner so it can be shipped the same day. We know that a defective CPC-4 is not just a damaged circuit board that causes an entire truck to break down, a load to be delayed, and a driver to be out of commission. We want to get you back on the road quickly. So if you need a CPC-4 repaired, contact us today.
The BGA derives from the pin grid array (PGA), a package in which one side is covered (or partially covered) with pins in a grid pattern that, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed. In a BGA, the pins are replaced by pads on the bottom of the package, each of which initially has a tiny solder ball stuck to it. These solder balls can be placed manually or using automated equipment and are held in place with a tacky flux. The component is placed on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or with an infrared emitter, which melts the balls. The surface tension causes the molten solder to hold the package at the proper distance from the PCB while the solder cools and solidifies, forming solder joints between the device and the PCB.
In more advanced technologies, solder balls can be used on both the PCB and the package. Stacked multi-chip modules also use solder balls (package to package) to connect two packages.
Our engineering team has over 15 years of experience, more than 10K repaired ECMs, and the latest simulation technology. We are always happy to assist you with any technical assistance we can. Feel free to contact us to discuss the faults you are experiencing before sending in your parts.
ECM Engineering USA / ECM Repair USA
